What is potting? Why pot?


A liquid potting compound is applied over a bordered PCB until it covers the electrical circuit of the components. This compound cures and solidifies effectively these components into a solid mass. This protects the electrical circuit from moisture, dust, contaminants, vibrations and impact damage.

It enhances electrical insulation, assembly robustness during transportation and installation, and flame retardation. Potted PCB assemblies significantly increase the safety factor against electrical shocks at the point of usage.

WECO's terminal blocks, headers and pin receptacles for potting processes are designed to accommodate the potting material without affecting free accessibility to wire entry ports.

There are two ways of installing terminal blocks dedicated for potting (see picture):
1. Terminal block is mounted on PCB edge and mating plug-in contact is facing outside of the board.
2. Terminal block is installed inside of the potting walls.

This quick reference guide shows our terminal blocks for potting processes. More details for each product can be found on the individual product pages.
Series 11 Series 12 Series 14 Series 15 Series 95 Series 97 Series 99 Series 300-P Series 300

Series 11
110-P-111 110-P-121 110-P-215
3.5 mm spacing
110-P-111
Potting feature
Types 110-P-111 terminal blocks have been specially designed to allow effective potting of PC boards up to 6 mm (0.25 in) when terminal block is mounted on PCB edge and mating plug-in contact is facing outside of the board. 		3.5 mm spacing
110-P-121
Potting feature
The molding design prevents seepage of the potting material into the mating plug-in contact up to 21 mm (0.83 in.) from the board. It can be installed inside of the potting walls. 		3.5 mm spacing
110-P-215
Potting feature
Types 110-P-215 terminal blocks have been specially designed to allow effective potting of PC boards up to 6 mm (0.25) when terminal block is mounted on PCB edge and mating plug-in contact is facing outside of the board.
110-P-225
3.5 mm spacing
110-P-225
Potting feature
The molding design prevents seepage of the potting material into the mating plug-in contact up to 15 mm (0.59 in.) from the board. It can be installed inside of the potting walls.
Series 12
Top of page
120-M-211 120-M-221 120-M-221-SMD
5 mm spacing
120-M-211
Potting feature
Types 120-M-211 terminal blocks have been specially designed to allow effective potting of PC boards up to 8 mm (0.315 in.) when terminal block is mounted on PCB edge and mating plug-in contact is facing outside of the board. 		5 mm spacing
120-M-221
Potting feature
The molding design prevents seepage of the potting material into the mating plug-in contact up to 8 mm (0.315 in.) from the board. It can be installed inside of the potting walls. 		5 mm spacing
120-M-221-SMD
Potting feature
The molding design prevents seepage of the potting material into the mating plug-in contact up to 8 mm (0.315 in.) from the board. It can be installed inside of the potting walls.
120-M-221-THR 120-M-225 120-M-227
5 mm spacing
120-M-221-THR
Potting feature
The molding design prevents seepage of the potting material into the mating plug-in contact up to 8 mm (0.315 in.) from the board. It can be installed inside of the potting walls. 		5 mm spacing
120-M-225
Potting feature
The molding design prevents seepage of the potting material into the mating plug-in contact up to 5 mm (0.197 in.) from the board. It can be installed inside of the potting walls. 		5 mm spacing
120-M-227
Potting feature
The molding design prevents seepage of the potting material into the mating plug-in contact up to 11 mm (0.43 in.) from the board. It can be installed inside of the potting walls.
120-M-181 /-281 120-M-191 /-291 120-M-285
5 mm spacing
120-M-181 /-281
Potting feature
The molding design prevents seepage of the potting material into the mating plug-in contact up to 13 mm (0.51 in.) from the board. It can be installed inside of the potting walls. 		5 mm spacing
120-M-191 /-291
Potting feature
120-M-191 (without sidewalls): the molding design prevents seepage of the potting material into the mating plug-in contact up to 13 mm (0.51 in.) from the board. It cannot be potted when installed on the edge of the PCB.
120-M-291 (with sidewalls): the molding design prevents seepage of the potting material into the mating plug-in contact up to 19 mm (0.75 in.) from the board. It can be installed inside of the potting walls. 		5 mm spacing
120-M-285
Potting feature
The molding design prevents seepage of the potting material into the mating plug-in contact up to 13 mm (0.51 in.) from the board. It can be installed inside of the potting walls.
 
120-M-295 121-M-181 /-281 121-M-191 /-291
5 mm spacing
120-M-295
Potting feature
The molding design prevents seepage of the potting material into the mating plug-in contact up to 13 mm (0.51 in.) from the board. It can be installed inside of the potting walls. 		0.2 in spacing
121-M-181 /-281
Potting feature
The molding design prevents seepage of the potting material into the mating plug-in contact up to 13 mm (0.51 in.) from the board. It can be installed inside of the potting walls. 		0.2 in. spacing
121-M-191 /-291
Potting feature
121-M-191 (without sidewalls): the molding design prevents seepage of the potting material into the mating plug-in contact up to 13 mm (0.51 in.) from the board. It can be installed inside of the potting walls.
121-M-291 (with sidewalls): the molding design prevents seepage of the potting material into the mating plug-in contact up to 19 mm (0.75 in.) from the board.
Series 14
Top of page
140-B-111 140-E-111 140-E-253
5 mm spacing
140-B-111
Potting feature
The molding design prevents seepage of the potting material into the wire clamping area up to 8 mm (0.315 in.) from the board. It can be installed inside of the potting walls. 		5 mm spacing
140-E-111
Potting feature
The molding design prevents seepage of the potting material into the wire clamping area up to 17 mm (0.669 in.) from the board. It can be installed inside of the potting walls. 		5 mm spacing
140-E-253
Potting feature
The molding design prevents seepage of the potting material into the wire clamping area up to 8 mm (0.315 in.) from the board. It can be installed inside of the potting walls.
Series 15
Top of page
150-B-111
5 mm spacing
150-B-111
Potting feature
The molding design prevents seepage of the potting material into the wire clamping area up to 17 mm (0.669 in.) from the board. It can be installed inside of the potting walls.
Series 95
Top of page
950-LH (-DS) 951-LH (-DS) 951-HG (-DS)
5 mm spacing
950-LH (-DS)
Potting feature
Types 950-LH terminal blocks have been specially designed to allow effective potting of PC boards up to 8 mm (0.315 in.) when terminal block is mounted on PCB edge and wire clamping area is facing outside of the board. 		5 mm spacing
951-LH (-DS)
Potting feature
Types 951-LH terminal blocks allow effective potting of PC boards up to 4 mm (0.157 in.). The molding design prevents seepage of the potting material into the wire clamping area.
When terminal block is mounted on PCB edge and wire clamping area is facing outside of the board allow effective potting of PC boards up to 9 mm (0.35 in.) 		5 mm spacing
951-HG (-DS)
Potting feature
These blocks have a closed back (-HG designation) to allow the effective use of potting compounds up to 6 mm (0.25 in.) when terminal block is mounted on PCB edge and wire clamping area is facing outside of the board.
 
Series 97
Top of page
970-LH (-DS) 970-HENO (-DS) 971-HG (-DS)
5 mm spacing
970-LH (-DS)
Potting feature
Types 970-LH terminal blocks have been specially designed to allow effective potting of PC boards up to 8 mm (0.315 in.) when terminal block is mounted on PCB edge and wire clamping area is facing outside of the board. 		5 mm spacing
970-HENO (-DS)
Potting feature
The molding design prevents seepage of the potting material into the wire clamping area up to 14 mm (0.55 in.) from the board. It can be installed inside of the potting walls. 		5 mm spacing
971-HG (-DS)
Potting feature
These blocks have a closed back (-HG designation) to allow the effective use of potting compounds up to 6 mm (0.25 in.) when terminal block is mounted on PCB edge and wire clamping area is facing outside of the board.
 
971-LH (-DS) 978-HENO (-DS)
5 mm spacing
971-LH (-DS)
Potting feature
Types 971-LH terminal blocks allow effective potting of PC boards up to 9 mm (0.35 in.). The molding design prevents seepage of the potting material into the wire clamping area.
When terminal block is mounted on PCB edge and wire clamping area is facing outside of the board allow effective potting of PC boards up to 13 mm (0.51 in.) 		5 mm spacing
978-HENO (-DS)
Potting feature
The molding design prevents seepage of the potting material into the wire clamping area up to 13 mm (0.51 in.) from the board. It can be installed inside of the potting walls.
Series 99
Top of page
990-FU-DS
5 mm spacing
990-FU-DS
Potting feature
The molding design prevents seepage of the potting material into the wire clamping area up to 3.8 mm (0.15 in.) from the board. It can be installed inside of the potting walls.
Series 300-P
Top of page
327-P-FU (-DS)
14.5 mm spacing
327-P-FU (-DS)
Potting feature
The molding design prevents seepage of the potting material into the wire clamping area up to 3.5 mm (0.138 in.) from the board. It can be installed inside of the potting walls.
Series 300
Top of page
327-FU (-DS)
14.5 mm spacing
327-FU (-DS)
Potting feature
The molding design prevents seepage of the potting material into the wire clamping area up to 3.5 mm (0.138 in.) from the board. It can be installed inside of the potting walls.
   2006, WECO Electrical Connectors Inc.ISO 9001:2000